Calculating the diffusivity of Cu and Sn in Cu3Sn intermetallic by molecular dynamics simulations
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منابع مشابه
Secondary IMC formation induced by Kirkendall voiding in Cu/Sn3.5Ag solder joints
In this investigation on the formation of multiple-layered Kirkendall voids at Cu/Sn– 3.5Ag solder joints, Sn–3.5Ag solder balls were reacted with Cu under bump metallurgy (UBM), which was electroplated using bis-sodium sulfopropyl–disulfide, C6H12O6S4Na2 (SPS) additive. The sequence of multilayer Kirkendall voids and Cu–Sn IMC (intermetallic compounds) formations are explained with the aid of ...
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